grand-hope-hard-felt-sicGrand-Hope Short-Fiber Hard Felt: The Ultra-Performance Guardian of Silicon Carbide Induction Furnacesgrand-hope-hard-felt-sic

Ultra-High-Temperature Purity Assurance

•Ash content <10 ppm, metallic impurities <5 ppm (semiconductor-grade purity), completely blocks silicon vapor erosion, reduces micro-pipe density in silicon carbide crystals by 83%.

•Gas-liquid composite coating technology constructs a “molecular shield,” improving silicon resistance by 300%.

•High-temperature purification process ensures zero contamination in the 2300℃ crystal growth environment.

Precise Thermal Field Control

PerformanceGrand-Hope Short-Fiber Hard FeltTraditional Materials
Thermal Conductivity0.038 W/(m·K)0.15 W/(m·K)
Temperature Uniformity±2℃ (throughout 2300℃)±15℃
Response SpeedMatches high-frequency electromagnetic field, millisecond-level temperature adjustmentDelayed by 3 – 5 seconds

Graded pore structure (50 – 300μm) locks thermal energy, increases crystal growth speed by 40%, and boosts single-furnace productivity by 25% .

Energy-Saving and Longevity Exemplar

•Energy consumption drastically reduced: Thermal efficiency improved by 45%, saving 800,000 kWh per furnace annually (equivalent to reducing 630 tons of CO₂ emissions).

•Lifespan breakthrough: Thermal shock resistance >1200 cycles (ΔT = 2000℃ thermal cycling), replacement frequency reduced from once per month → once per year , annual maintenance costs reduced by 2 million CNY.

•Rigid yet flexible damage resistance: Three-dimensional fiber-reinforced structure resists electromagnetic vibration deformation, thermal shrinkage rate <0.3% at 2300℃.

Customer Case Study

A silicon carbide wafer manufacturer achieved the following results after adopting Grand-Hope Short-Fiber Hard Felt:

•Energy consumption: Electricity consumption per ton of crystals reduced by 52% (1580 kW·h → 760 kW·h).

•Yield rate: Defect rate for 6-inch substrates decreased from 15% → 3.8%.

•Cost: Annual expenditure on thermal field components reduced by 3 million CNY.

Grand-Hope New Materials——Defining the new standard for third-generation semiconductor thermal fields with nano-scale carbon architecture!


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